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| MEDIUM POWER PHEMT MMIC * FEATURES 26.5 GHz to 29.5 GHz Frequency Band +22 dBm Output Power at 1dB Compression 19 dB Gain +5 V Dual Bias Supply LMA442 * DESCRIPTION AND APPLICATIONS The LMA442 is a medium power pHEMT amplifier that operates from 26.5 to 29.5 GHz. This 3stage amplifier provides 19 dB linear power gain with 1-dB gain compression power output of greater than +22 dBm. The LMA442 is designed for LMDS/LMCS applications. Ground is provided to the circuitry through vias to the backside metallization. * ELECTRICAL SPECIFICATIONS @ TAmbient = 25C (VDD = +5.0V, ZIN = ZOUT = 50) Parameter Frequency Band Power at 1-dB Compression Power at Saturation Small Signal Gain Small Signal Gain Flatness Input Return Loss Output Return Loss Reverse Isolation Saturated Drain Current Symbol F P-1dB PSAT S21 S21 S11 S22 S12 IDSS -8.5 -7.5 -30 250 75% IDSS 75% IDSS 75% IDSS Test Conditions Min 26.5 21 23 18 22 24 19 1 -10 -10 -40 350 450 2 Typ Max 29.5 Units GHz dBm dBm dB dB dB dB dB mA Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 06/21/01 Email: sales@filss.com MEDIUM POWER PHEMT MMIC * ABSOLUTE MAXIMUM RATINGS Parameter Drain Voltage Operating Current RF Input Power Total Power Dissipation Channel Operating Temperature Storage Temperature Maximum Assembly Temperature (1 min. max.) Symbol VD IOP PIN PTOT TCH TSTG TMAX Test Conditions TAmbient = 22 3 C TAmbient = 22 3 C TAmbient = 22 3 C TAmbient = 22 3 C TAmbient = 22 3 C -- -- -65 Min Max 6 495 12 4 150 165 300 Units V mA dBm W C C C LMA442 Notes: * Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device. * Recommended Continuous Operating Limits should be observed for reliable device operation. * Power Dissipation defined as: PTOT (PDC + PIN) - POUT, where PDC: DC Bias Power PIN: RF Input Power POUT: RF Output Power * This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices. Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 06/21/01 Email: sales@filss.com MEDIUM POWER PHEMT MMIC * ASSEMBLY DRAWING LMA442 Notes: * Recommended lead bond technique is thermocompression wedge bonding with 0.001" (25m) diameter wire. The bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240C, heated tool (150-160C) is recommended. Ultrasonic bonding is not recommended. * The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150C for 45 minutes. * Bond on bond or stitch bond acceptable. * Conductor over conductor acceptable. Conductors must not short. Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 06/21/01 Email: sales@filss.com MEDIUM POWER PHEMT MMIC * MECHANICAL OUTLINE LMA442 Notes: * * * * All units are in microns (m). All bond pads are 100 X 100 m 2. Bias pad (VDD) size is 100 X 121.5 m 2. Unless otherwise specified. * HANDLING PRECAUTIONS To avoid damage to the devices care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 1A (0-500 V). Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263. All information and specifications are subject to change without notice. Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 06/21/01 Email: sales@filss.com |
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